Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...

A new technical paper titled “Revisiting Wireless Cyberattacks on Vehicles” was published by researchers at Comillas ...

Sensor and Data Collection ADAS/AD relies heavily on perception sensors like cameras, radars, LiDARs, ultrasonics, and, more ...

Aerospace safety requirements and standards vary depending on whether a spacecraft is manned or unmanned, and how crucial the ...

In AI data centers, there are two main types of interconnects: Scale-Out: Optical links connect switches across racks and ...

As cars have evolved into rolling computing platforms, vehicle safety now extends well beyond the traditional seat belt.

On-die Digital Impedance Sensing for Chiplet and Interposer Verification” was published by researchers at Worcester ...

Opening the door to third-party chiplet makers requires new approaches, greater diligence, and a deeper focus on security.

TSMC held its North America Technology Symposium on Wednesday, April 23, 2025 at the Santa Clara Convention Center and ...

Forward-thinking companies consider AI in product development to meet the demand for intelligent devices. In other words, ...

Researchers from the University of Tokyo propose cooling chips using microchannels built into the chips themselves. The ...

As concern about breaches filters into everything from fridges to data centers, calculating power requirements becomes ...