Until now, GPUs such as those from AMD and Nvidia have consisted of several chiplets located next to each other on a silicon interposer ... in general all possible process variants are conceivable.

Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog ... 3Dblox and enabling TSMC's CoWoS technology with 5.5x-reticle interposer sizes. "Synopsys ...

IP subsystem in TSMC’s 16nm FF+ process in combination with TSMC’s CoWoS® 2.5D silicon interposer technology. This full IP subsystem solution includes an HBM2 controller, PHY and interposer I/O, all ...

H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit SEOUL, Korea -- November 11, 2021-- ...