Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel ...

School of Chemical Engineering and Technology, National Engineering Research Center of Distillation Technology, Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), Tianjin ...

Cadence’s HBM4 solution includes a comprehensive set of deliverables for faster integration of the IP to SoC design and post-silicon bring up. The deliverables include a reference interposer ...

Shanghai Key Laboratory of Multiphase Materials Chemical Engineering, School of Chemical Engineering, East China University of Science and Technology, Shanghai 200237, People’s Republic of China ...

SUNNYVALE, Calif., --November 18, 2002 - Virtual Silicon Technology Inc., a leader in semiconductor intellectual property (SIP), today announces the introduction of a family of IP products targeted ...

AMD has achieved a 2nm silicon milestone with its EPYC 'Venice' CPU, built on TSMC's N2 process, marking a leap for high-performance computing. AMD positions this as the industry’s premier HPC ...

When rules on food and feed marketed in Great Britain (GB) need to change we use our own risk analysis process rather than the EU’s process. EFSA are responsible for assessing food and animal feed ...

Breakthrough 3D photonic interposer enables highest bandwidth and largest die complexes for next-gen AI infrastructure silicon designs. Lightmatter has launched Passage™ M1000, a groundbreaking 3D ...