Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel ...

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

Adding it all up, our operating cash flow improved in Q1 to EUR 35 million ... CPU and memory and so on all on a silicon interposer or potentially some work ongoing on a glass interposer where ...

U.S. tech leaders will spend more than $300 billion on AI infrastructure in 2025, with cloud, compute, and custom silicon at the ... and HBM side by side on an interposer, CoWoS reduces latency ...

Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog ... 3Dblox and enabling TSMC's CoWoS technology with 5.5x-reticle interposer sizes. "Synopsys ...

Until now, GPUs such as those from AMD and Nvidia have consisted of several chiplets located next to each other on a silicon interposer ... in general all possible process variants are conceivable.

Advances in materials and architecture could lead to silicon-free chip manufacturing thanks to a new type of transistor.

Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI, and networking applications. The PHY’s ... The ...

Ansys and Intel Foundry are also extending the collaboration to cover next-generation EMIB-T technology that will add through-silicon vias (TSVs) to EMIB. The EMIB-T flow is expanded to include ...

Taiwan plans to tighten control over exports of advanced process technologies as well as outbound semiconductor investments, reports Economic Daily. The new legal measures will enforce the 'N-1 ...

supports 3Dblox and enables TSMC's CoWoS technology with 5.5x-reticle interposer sizes. In addition, Synopsys provides complete, silicon-proven IP solutions on TSMC's advanced processes, enabling ...