Digital 'memory palace' illuminates how locations help us encode memories

It's obvious to most people as soon as they set foot in a place they know well—like their childhood bedroom or a former ...
IEEE

3-D Vertical Resistive Switching Random Access Memory (3D-VRRAM) With Multilevel Programming for High-Density, Energy-Efficient In-Memory Computing

Abstract: Resistive random access memory (RRAM) devices offer a broad range of attractive properties for in-memory computing (IMC) applications, such as nonvolatile storage, low read current, and high ...
IEEE

Low-energy, high-accuracy convolutional network inference in 3D crosspoint (3DXP) arrays

Abstract: In-memory computing (IMC) has emerged as a promising solution for artificial intelligence (AI) accelerators thanks to the reduced data movement and improved parallelism in the crosspoint ...
Science Daily

This new 3D chip could break AI’s biggest bottleneck

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...
SciTech Daily

This New 3D Chip Could Shatter the “Memory Wall” Holding Back AI

Researchers from several leading U.S. universities and industry have created a new kind of computer chip that stacks memory and computing vertically, dramatically improving how fast data can move ...
ExtremeTech

Researchers Develop Dense 3D Chip for AI Processing

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.