"Our extensive background with both the integration of HMC IP and advanced design techniques is enabling a new generation of ASICs designed to address the growing bandwidth requirements of 100G and ...
A memory module technology from the Hybrid Memory Cube Consortium (HMCC), spearheaded ... provide 15 times the bandwidth of DDR3 chips while consuming 70% less power and 90% less space.
High-bandwidth memory (HBM), integrated with 2.5D technology, achieves higher bandwidth while using less power in a substantially smaller form factor than DDR4, GDDR5 or hybrid memory cube (HMC).
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