A new technical paper titled “Solving sparse finite element problems on neuromorphic hardware” was published by researchers ...
A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Abstract: The integrity and longevity of road infrastructure are critical for ensuring safe and efficient transportation. How-ever, road deterioration is a pervasive issue, exacerbated by the ...
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