The OPPO Find X8s is the company’s new high-end compact phone Needless to say, the OPPO Find X8s is likely the more interesting one, as it packs a lot of power in a rather compact package.

Abstract: Wire bonding as a metallic interconnection is widely used to transmit high-speed signals and supply power within the integrated circuits (IC) packages. However, bonding wires also ...

Figure 1 shows the complete package with cooling and PCB (left), chip layers for 2D and 2-dies 3D-IC with FS-PDN and BS-PDN (middle), and chip layers for 3-dies 3D-IC (right) (schematic only, not to ...

Taking the brazing mechanism of alumina ceramics and kovar alloys as the main research object, based on the molybdenum–manganese metallization method, the influence of the direct and indirect brazing ...

More specifically, ECD is used to deposit metals in the key interconnect structures within an IC package, such as bumps, copper pillars, redistribution layers (RDLs) and through-silicon vias (TSVs).