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BrainChip’s Akida NPU: Redefining AI Processing with Event-Based Architecture
BrainChip has launched the Akida Pico, enabling the development of compact, ultra-low power, intelligent devices for applications in wearables, healthcare, IoT, defense, and wake-up systems, ...
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STMicroelectronics and Qualcomm Expand Collaboration to Drive Wireless IoT Solutions
Artificial intelligence-driven next generation of industrial and consumer IoT products will be enabled by a new strategic alliance between STMicroelectronics and Qualcomm Technologies. In an interview ...
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Advancing FPGA Technology: Altera’s Strategic Innovations and Future Goals
Altera, an Intel company, has introduced its next-generation Agilex 3 FPGAs, designed to enhance power, performance, and security for embedded and intelligent edge applications. Revealed at Altera‘s ...
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Innatera for the Sensor Edge with Brain-Inspired Technology
A Dutch neuromorphic computing startup, Innatera, is transforming sensor-edge processing with its Spiking Neural Processor (SNP) technology. What started as a spinout from Delft University of ...
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Korean Chipmakers’ Reliance on Chinese Raw Materials Intensifies
According to a news published in The Korea Times, Korean chipmakers’ dependence on raw materials imported from China intensified last year. This happened despite the increasing global supply chain ...
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On-Chip Quantum Photonic: Scaling Quantum Computing with Integrated Entangled Light Sources
An international team of researchers from Leibniz University of Hannover, the University of Twente, and the start-up QuiX Quantum has demonstrated a fully integrated entangled quantum light source on ...
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KYOCERA AVX Introduces a New Series of IDC Splice Connectors
KYOCERA AVX has launched the new 9179-000 Series IDC Splice Connectors, equipped with capabilities that render them a compelling alternative to conventional splicing options. The 9179-000 Series IDC ...
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Keep Costs Reasonable for Hybrid Stack-Up RF PCBs
The industry is moving into hybrid layered or stack-up PCBs driven by today’s advances in RF technology and a variety of burgeoning RF applications. However, key questions and issues arise: Which ...
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Synopsys and TSMC Collaborate to Deliver Advanced EDA and IP Solutions for AI and Multi-Die Designs
Synopsys, Inc. declared its ongoing, close partnership with TSMC to provide sophisticated EDA and IP solutions utilizing TSMC’s cutting-edge process and 3DFabric technologies to expedite innovation in ...
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Boosting Efficiency and Reducing Costs: Silvaco’s Approach to Semiconductor Fabrication
Silvaco is advancing the electronics industry with its most recent technological innovations. Leveraging its understanding of semiconductor technologies, the business has created the artificial ...
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Is Agile a Silver Bullet to Software Development Success?
In the beginning, there was Waterfall, and developers saw it was good. Software was formed in a series of linear stages, each neatly following the last. Development was logical and well thought out, ...
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Ceva and Edge Impulse Collaborate to Facilitate Accelerated and Simplified Development of Edge AI Applications
Ceva, Inc. and Edge Impulse have established a partnership to augment the Ceva-NeuPro-Nano NPUs with compatibility with the Edge Impulse Platform. This interface will allow AI developers to expedite ...