AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Companies that were hit with chip shortages during the pandemic are changing their strategies to prevent future problems, deploying a combination of supply chain mapping, second sourcing, and digital ...

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but questions persist about the impact of increasing reliance on what is essentially a ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

As AI infrastructure fragments into specialized tiers, CPUs are becoming the orchestration layer for agentic workloads.

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.