Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel ...

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

U.S. tech leaders will spend more than $300 billion on AI infrastructure in 2025, with cloud, compute, and custom silicon at the ... and HBM side by side on an interposer, CoWoS reduces latency ...

Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog ... 3Dblox and enabling TSMC's CoWoS technology with 5.5x-reticle interposer sizes. "Synopsys ...

Until now, GPUs such as those from AMD and Nvidia have consisted of several chiplets located next to each other on a silicon interposer ... in general all possible process variants are conceivable.

Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI, and networking applications. The PHY’s ... The ...

supports 3Dblox and enables TSMC's CoWoS technology with 5.5x-reticle interposer sizes. In addition, Synopsys provides complete, silicon-proven IP solutions on TSMC's advanced processes, enabling ...

Synopsys (SNPS) announced a broad Electronic Design Automation, or EDA, and Intellectual Property collaboration with Intel ...

TSMC grows thanks to demand for modern semiconductors. AI accelerators dampen the weakening end customer market.

Cadence’s HBM4 solution includes a comprehensive set of deliverables for faster integration of the IP to SoC design and post-silicon bring up. The deliverables include a reference interposer design ...