Abstract: Data-centric applications such as Artificial Intelligence and IoT are putting stringent performance and energy efficiency constraints on hardware implementations of computing architectures.
Abstract: This study introduces a breakthrough achievement of 0.1-Gb/mm2 wing-shaped high-density embedded 3-D via resistive random access memory (Via RRAM) in TSMC’s 16-nm FinFET CMOS logic process.
Notes for MATH700132 (Mathematical Logic) taught by David Evans at Imperial in Spring 2025. They are a work in progress. These notes are primarily based on the content covered in lectures, with some ...
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