Abstract: This paper presents a silicon-based chip bonding process applied to system-in-package devices. The influence of chip bonding process parameters on the quality of micro-chips and large-chips ...
Abstract: This research work introduces an integrated design of a solar and wind based hybrid system controlled and coordinated by Arduino. One of the primary needs for socio-economic development of ...
deviceid provides a device ID for a given system, based on the DevDeviceId specification. This project welcomes contributions and suggestions. Most contributions require you to agree to a Contributor ...
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