Amkor: A Better Business, But Execution Is Already Priced In

Amkor is shifting to advanced packaging, boosted by a $7B Arizona CHIPS-backed expansion. Read why I am rating AMKR stock a ...
IEEE

The effects of additives on electrochemical behaviours, microstructure and resistivities evolution of copper during electrodeposition

Abstract: In the field of microelectronic packaging, copper electrodeposition is one of the core technologies for achieving high-density interconnection and advanced packaging. This process makes full ...
DIGITIMES

AMIES Technology acquires SMEE affiliate in US$32m deal, clarifying China's lithography split

China's domestic lithography sector is entering another phase of internal restructuring, with AMIES Technology consolidating ...
IEEE

Investigating Competing Failure Modes in Microelectronic Devices Due to Small Temperature Variations

Abstract: Electronic packages with solder interconnects, such as Chip Scale Packages (CSP) and Ball Grid Arrays (BGA), are extensively utilized in various applications, including cell phones, ...

Tianma unveiling 108" 4K Micro-LED Display at CES 2026 World's first to employ all-laser mass transfer technology from wafer to glass backplane

Tianma's 108" 4K Micro-LED Display features Tianma's all-laser mass transfer process -- from wafer to carrier to glass-based LTPS backplane -- eliminating common PCB substrate issues such as flicker, ...

GSME Secures $35M Series B Funding

GS Microelectronics U.S., Inc. (GSME) today announced a $35 million Series B round led by Maverick Silicon to expand its semiconductor services platform across advanced packaging, design enablement, ...