Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator
Abstract: The semiconductor industry has deployed chiplet-based system-on-chip architectures for several years. Central to a successful chiplet-based product is the die-to-die interconnect technology ...
Abstract: The increasing integration of Renewable Energy Sources (RESs) into power systems exhibits unique challenges due to their inherent variability and the complexity of grid integration. This ...
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