Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs and strengthen its ...

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

The basics: Which Intel processor is best and what should I choose? Latest Intel laptop reviews Intel processors: key terms you need to know What are Intel processor performance cores and efficiency ...

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Optical technology is well established for long-haul communications, but the distances it serves are shrinking — especially in the data center. Vertical-cavity surface-emitting lasers (VCSELs) already ...

Abstract: Silicon interposer re-usage is drawing attention for cost-effective multi-chiplet integrated systems. To address the communication awareness of inter/off-chiplet interconnect, the paper ...

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Abstract: Copper-filled via is a critical component of advanced electronic packaging technologies. Embedded in interposer substrate, vias provide enhanced electrical performance in 2.5-D and 3-D ...