Packsize has integrated Sitma's e-Wrap and Fast Pack series of mailer creation systems into its offerings for e-commerce ...

The range of topics to be covered at ECTC 2025 encompasses heterogeneous integration, photonics, components, materials, assembly, reliability, modeling, interconnect design and technology, ...

Murugappa Group's Axiro Semiconductor aims to dominate chip design with Indian IP, serving global clients with innovative ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the ...

Global gold prices have surged to an all-time high of US$3,500 per ounce, putting significant cost pressure on the ...

According to Towards Packaging Consultants, the vertical form-fill-seal (VFFS) machines market size stood at USD 2.78 billion ...

Before the approval, the Murugappa group had donated only Rs 21 crore to the BJP over a decade. It has no previous experience ...