There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and ...

The South Korean memory leader noted strong demand of memory for AI servers, with HBM memory share of DRAM ... wild with the fastest HBM3E memory on-board). SK hynix reported revenues of 17. ...

Within Semi Test the memory business delivered record high revenue in the third quarter on a strong HBM demand ... and our Production Board Test business continues to be weak mainly due to ...

We continue to see AI driving strong investments in leading-edge logic nodes, as well as advanced packaging segments, including high-bandwidth memory or HBM ... on our Board authorized share ...

Q1: This new world of AI requires High Bandwidth Memory (HBM ... and creation of microbumps is essential to stack HBM chips. Meanwhile, 2.5D today uses multi-layer submicron metal lines on a silicon ...

Heterogeneous approaches allow companies to combine different technologies — such as logic, memory, analog, and RF — into one ... across the ecosystem — from substrate design and interposer ...

A few decades ago, when you put two caps on the board next to the chips you were protecting ... “We’re seeing people placing the capacitors at the interposer/bridge level,” said Chris Ortiz, senior ...

HBM uses 3D TSV and 2.5D TSV technologies to stack multiple memory chips together in 3D TSV, and 2.5D TSV technology to interconnect the stacked memory chips with the GPU on the carrier board ... with ...

Ample data transfer bandwidth and flexibility are provided by a range of board interfaces including 1 GigE, 10 GigE, 40 GigE, 100 GigE, and PCIe with the installation of Mercury or user-supplied IP.

Delivering unrivaled memory bandwidth in a compact, high-capacity footprint, has made HBM the memory of choice for AI ...