Investigating Competing Failure Modes in Microelectronic Devices Due to Small Temperature Variations
Abstract: Electronic packages with solder interconnects, such as Chip Scale Packages (CSP) and Ball Grid Arrays (BGA), are extensively utilized in various applications, including cell phones, ...
11d
The Intelligence Reuse Index: The Metric That Will Decide Which Banks Actually Scale Enterprise AI
The Intelligence Reuse Index (IRI) measures how much of an institution’s AI capability can be reused safely and repeatedly ...
Your kidneys are among the most remarkable organs that work tirelessly, filtering waste and excess fluid from your blood all the time. Yet chronic kidney disease is often known as a 'silent killer' ...
"No threat to Indian citizens in Iran, situation under control": Tehran's envoy ...
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