Abstract: Aiming to solve high parasitic inductance, uneven thermal stress, and excessive junction temperature of power module, a novel 3D stacked packaging architecture incorporating a direct plated ...
Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results