Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...

A chip smaller than one square millimeter stores 160 holographic images at arbitrary 3D coordinates, with each spatial ...

NEO Semiconductor has just unveiled the development of its new 3D X-AI chip technology, which aims to replace DRAM chips inside of HBM to solve data bus bottlenecks, by enabling AI processing through ...

Advanced Micro Devices, Inc.'s new 2.5/3D AI chips have the potential to reshape data centers and lead the AI computing chip sector. These chips offer enhanced performance, reduced power consumption, ...

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...

A new chip-based quantum memory uses 3D-printed “light cages” to store light in atomic vapor with high precision. Quantum ...

A new cryogenic plasma etching technique developed by Japanese researchers dramatically accelerates semiconductor fabrication ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...