Integrated circuit (IC) sizes continue to grow as they meet the compute requirements of cutting-edge applications such as artificial intelligence (AI), autonomous driving, and data centers. As design ...

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass ...

Water — lots of it — is a critical enabler for advanced chip architectures, lithography, and back-end packaging. It feeds the ultra-pure water loops that touch every wafer, sluicing heat out of tools ...

AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

As AI infrastructure fragments into specialized tiers, CPUs are becoming the orchestration layer for agentic workloads.

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

The conversation about agentic AI in semiconductor and PCB design tends to focus on capability: what the agent can do, how much time it saves, and which parts of the workflow it can automate. That is ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...