AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management solutions cannot meet the current demand, and interest in nuclear power for ...

Companies that were hit with chip shortages during the pandemic are changing their strategies to prevent future problems, deploying a combination of supply chain mapping, second sourcing, and digital ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process nodes. Magnetic RAM (MRAM) and resistive RAM (RRAM) appear to be the heirs ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but questions persist about the impact of increasing reliance what is essentially a ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and alignment control at back-end volumes and costs.

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

Every generation of AI infrastructure has redefined what “the network” means. In today’s training clusters — scaling from hundreds to hundreds of thousands of accelerators — the interconnect is no ...

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.