Until now, GPUs such as those from AMD and Nvidia have consisted of several chiplets located next to each other on a silicon interposer ... in general all possible process variants are conceivable.

A*STAR's Institute of Microelectronics (IME) and United Test and Assembly Center (UTAC), a leading outsourced assembly and test (OSAT) provider, have announced a collaboration to develop a 2.5D ...

Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog ... 3Dblox and enabling TSMC's CoWoS technology with 5.5x-reticle interposer sizes. "Synopsys ...

IP subsystem in TSMC’s 16nm FF+ process in combination with TSMC’s CoWoS® 2.5D silicon interposer technology. This full IP subsystem solution includes an HBM2 controller, PHY and interposer I/O, all ...

This milestone was achieved using TSMC’s advanced N3P process and CoWoS® packaging technologies ... and East-West IP orientations are interconnected through CoWoS interposer. The silicon measurements ...