Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has ...
Researchers have now developed a new superior hardware platform for artificial intelligence accelerators using photonic integrated circuits on silicon chip. Co-packaged optics (CPO) technology can ...
New manufacturing process enables higher yields, increased optical performance and the use of high index polymer or glass substrates ROCHESTER, N.Y., Aug. 13, 2024 /PRNewswire/ -- Vuzix® Corporation ...
Ultrathin structures that can bend, focus, or filter light, metasurfaces are reshaping how scientists think about optics. These engineered materials offer precise control over lights behavior, but ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback