There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and ...

We recommend buying Micron stock for its focus on high-margin memory products and potential growth, despite risks. Read more ...

TrendForce reveals that HBM5 20hi stack products will adopt hybrid bonding technology by 2025, which could transform DRAM industry's business models ...

SK hynix unveils the industry's first 16-Hi HBM3E memory, offering up to 48GB per stack for AI GPUs with even more AI memory in the future.

HBM chips, which stack memory vertically to reduce power consumption, are essential in AI applications. The company expects ...

During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in ...

SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer ...

Key HBM Gen2 PHY product highlights include support for DRAM 2, 4 and 8 stack height, a DFI-style interface to the memory controller, 2.5D interposer connections between the PHY and DRAM, a validated ...

Major HBM manufacturers are considering whether to adopt hybrid bonding for HBM4 16hi stack products but have confirmed plans to implement this technology in the HBM5 20hi stack generation.