The Next Platform10d
We Can’t Get Enough HBM, Or Stack It Up High Enough
There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and ...
Applied Materials: Q4, Growing Advanced Packaging Business
Applied Materials is expected to double its advanced packaging business in the coming years. Read why I reiterate a Buy ...
Hosted on MSN5d
Samsung Electronics to expand chip packaging facilities for HBM
SEOUL, Nov. 12 (Yonhap) -- Samsung Electronics Co. will expand its semiconductor package facilities in South Chungcheong ...
DMR News (English) on MSN4mon
Huawei and Wuhan Xinxin team up on high-bandwidth memory chips despite US restrictions.
This technology enables the stacking of different types of semiconductors, such as graphics processing units (GPUs) and HBM ...
EconoTimes13d
Samsung Defies NVIDIA Fall-Out Rumors, Eyes HBM3E Integration in AI Accelerators Next Quarter
Samsung appears poised to overcome setbacks in its quest to supply HBM3E memory to NVIDIA, aiming to establish itself in the ...
Design-Reuse7y
Design Considerations for High Bandwidth Memory Controller
High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...
Samsung To Expand Chip Packaging Facilities For HBM
Under a memorandum of understanding with the provincial government, Samsung Electronics will convert an underused liquid ...