High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...

There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and ...

For advanced memory stacking, SK Hynix employs innovative packaging technologies, including Through Silicon Via (TSV) and the ...

SK hynix continues to solidify its lead in the HBM market, propelled by increased ... 12-high, and 16-high TSV stacks. The exact configurations of initial HBM4 modules are still uncertain, Samsung ...