The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

It is a crucial analytical field that is able to enhance the profitability and efficiency of polymeric products and supports research and development applications of polymer materials. In severe cases ...

Once confined to analyzing returns, it now is shifting left and right as more data analytics are applied to both digital and analog. Failure analysis is rapidly becoming a complex, costly and ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

This note will give you a quick overview on the basics of failure analysis. It will cover insights on how investigation and analysis of failed products help to determine the failure mode and the root ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

A technical look at the failure of a 150-tonne jacking cylinder, examining stress factors, design limits, and mechanical wear ...

Standard electrogalvanized coating thicknesses tend to range from 5 µm to 8 µm. Homogeneity is key to ensuring premium adhesive behavior, in terms of the upper layers’ adhesion to the coating and the ...

Failure analysis is one of the best tools for any aerospace supplier or manufacturer. The scientific method-based approach to establishing cause and effect can be used across all phases of a product's ...