Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...

A chip smaller than one square millimeter stores 160 holographic images at arbitrary 3D coordinates, with each spatial ...

New type of microchip created which not only moves information from left to right and back to front, but up and down as well Scientists from the University of Cambridge have created, for the first ...

NEO Semiconductor has just unveiled the development of its new 3D X-AI chip technology, which aims to replace DRAM chips inside of HBM to solve data bus bottlenecks, by enabling AI processing through ...

A new chip-based quantum memory uses 3D-printed “light cages” to store light in atomic vapor with high precision. Quantum ...

AMD has teased the launched of a new Ryzen processor with two chiplets, each of which will include a healthy dollop of 3D V-Cache.

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...

(Nanowerk News) Imagine a portable 3D printer you could hold in the palm of your hand. The tiny device could enable a user to rapidly create customized, low-cost objects on the go, like a fastener to ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existing ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...