Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Team led by IIT Kharagpur graduates, Subhasish Mitra and Tathagata Srimani delivers first monolithic 3D chip built in a U.S.

NEO Semiconductor has just unveiled the development of its new 3D X-AI chip technology, which aims to replace DRAM chips inside of HBM to solve data bus bottlenecks, by enabling AI processing through ...

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...

New type of microchip created which not only moves information from left to right and back to front, but up and down as well Scientists from the University of Cambridge have created, for the first ...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existing ...

Researchers have demonstrated the first chip-based 3D printer, a tiny device that emits reconfigurable beams of visible light into a well of resin that rapidly cures into a solid shape. The advance ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...